‘Custom’ water cooling loops are really best done, very simple. Sure, you can buy compression fittings and such, but zip ties, barbs, and a good set of flush cutters work better. After that, it’s just those nice plastic QDC fittings - which are actually exactly the same as what are used for another industry - and those are essentially a specialized hydraulic fitting.
In the end, so called ‘custom’ water cooling loops are much simpler than their reputation suggests, and just allow you to ‘choose’ better components. Same as building a ‘custom’ PC.
Problem with air cooling is at 350W per chip, with a need to minimize temperatures for overclocking, we are at the limits of what works reasonably well. For those who know how, water cooling will actually be more convenient than air cooling.
Also, it would be wise for everyone to sharpen up their skills. Next generation beyond this will benefit hugely from chilled cooling, just to beat the thermal resistance of the waterblock.
Add another generation or two after that, and we will be running water through holes in the chips for about 3x the TDP.
The final technological evolution in computer cooling may well be liquid metal running through plated holes in silicon chips.
@DrWilken It’s not that the thermal paste can’t be re-applied, it’s that the technique is getting fundamentally unreliable, and the pressures required to mount such heavy heatsinks is starting to put the chips at risk every time the screws are tightened. If things loosen up, they have to be redone. Too cowardly, and not all of the chip’s surface is contacting the heatsink. Maybe it just fails when you don’t have time for maintenance. Too foolhardy, and a very loud, very expensive, snap, will be heard.
I have had enough of playing with those kind of risks.
Build it once. Build it right. Resell in two years.